21-08-2014, 04:06 PM
One of the main factors that limit the performance of today’s integrated circuits (ICs) is their architecture. Today, more than 50% of the dynamic power consumption is due to interconnects and this rate is projected to increase. Global interconnect length does not scale with transistors and local wires. Because of functionality increase, chip size remains relatively constant. RC delay is also increasing exponentially.
Going 3D is the possible solution to this problem. Three-dimensional (3D) integration is an emerging technology that is expected to lead to an industry paradigm shift due to its tremendous benefits. Worldwide academic and industrial research activities currently focus on technology innovations, simulation and design, and product prototypes. Anticipated applications start with memory, portable device and high-performance computers and extend to high-density multifunctional heterogeneous integration of infotech-nanotech-biotech systems. It replaces long horizontal interconnects with short vertical ones. Bringing the components closer to each other in this manner could not only make these systems faster owing to a reduction in the average length of the interconnect wires, but also more versatile because more and more transistors could be crammed in a relatively small area.
This report gives a basic introduction to three dimensional Integrated Circuits, what are the motivations that lead to its creation, the important technologies that have been developed for its fabrication, the major issues or the technical concerns that surrounds it and finally its advantage over its 2D counterpart.