30-09-2013, 03:38 PM
A SEMINAR REPORT ON MICROMACHINING
MICROMACHINING.doc (Size: 1.8 MB / Downloads: 117)
INTRODUCTION TO MICROMACHINING
Miniaturization is the order of the day. Until recently a decade ago traditionally watch parts were considered to be the micro components one can think off. Recent changes in society’s demand have forced us to manufacture variety of micro components used in different fields starting from entertainment electronics to bio medical implants.
We are all familiar with the phrase “the world is getting smaller.” However, it is not just that the world is getting smaller, practically everything we use is getting smaller. Manufacturing technology has advanced to higher levels of precision to satisfy the increasing demand to reduce the size of parts and products in the electronics, computer, and biomedical industrial sectors. New processing concepts, procedures and machines are thus needed to fulfill the increasingly stringent requirements and expectations.
In the traditional mechanical/manufacturing engineering communities it implies material removal processes at a certain scale (not clearly defined), while for others including those who were the principal force behind the development of micro-electro-mechanical-systems (MEMS) technologies, this term encompasses the universe of silicon processing techniques for MEMS devices that were adopted or suitably modified from lithography-based techniques that are prevalent in integrated circuit manufacture.
Optical Materials
Also of interest in telecommunications and photonics applications are optical materials such as lithium niobate, lithium tantalate, indium phosphide, GaAs and other similar semiconductor compounds. Such materials are used in products such as lasers, amplifiers, modulators and switches and commonly require structures and features of high quality. Although nanosecond lasers can be used for the micromachining of these materials, femtosecond pulse lasers do provide excellent results without causing damage to other features in close proximity to the machined site.
WORKING
Laser is emitted from the source is passed through the energy attenuator. After it is passed through the beam homogenizer to homogenize the beam. The target illuminator and machine vision controls the beam to the focusing lens. The lens is moved by precision motion stages. The beam is then falls on the work piece and the machining is takes place.