12-11-2012, 06:21 PM
Allen and Holberg - CMOS Analog Circuit Design
Allen and Holberg - CMOS Analog Circuit Design.pdf (Size: 2.11 MB / Downloads: 34)
INTRODUCTION
GLOBAL OBJECTIVES
• Teach the analysis, modeling, simulation, and design of analog circuits
implemented in CMOS technology.
• Emphasis will be on the design methodology and a hierarchical
approach to the subject.
SPECIFIC OBJECTIVES
1. Present an overall, uniform viewpoint of CMOS analog circuit design.
2. Achieve an understanding of analog circuit design.
• Hand calculations using simple models
• Emphasis on insight
• Simulation to provide second-order design resolution
3. Present a hierarchical approach.
BASIC FABRTICATION PROCESSES
Basic Steps
· Oxide growth
· Thermal diffusion
· Ion implantation
· Deposition
· Etching
Photolithography
Means by which the above steps are applied to selected areas of the silicon
wafer.
Deposition
Deposition is the means by which various materials are deposited on the
silicon wafer.
Examples:
· Silicon nitride (Si3N4)
· Silicon dioxide (SiO2)
· Aluminum
· Polysilicon
There are various ways to deposit a meterial on a substrate:
· Chemical-vapor deposition (CVD)
· Low-pressure chemical-vapor deposition (LPCVD)
· Plasma-assisted chemical-vapor deposition (PECVD)
· Sputter deposition
Materials deposited using these techniques cover the entire wafer.