28-03-2012, 11:50 AM
Double data rate synchronous dynamic random access memory (DDR SDRAM)
Double data rate synchronous dynamic random access memory (DDR SDRAM) is a class of memory integrated circuits used in computers. DDR SDRAM (sometimes referred to as DDR1 SDRAM) has been superseded by DDR2 SDRAM and DDR3 SDRAM, neither of which are either forward orbackward compatible with DDR SDRAM, meaning that DDR2 or DDR3 memory modules will not work in DDR equipped motherboards, and vice versa.
Compared to single data rate (SDR) SDRAM, the DDR SDRAM interface makes higher transfer rates possible by more strict control of the timing of the electrical data and clock signals. Implementations often have to use schemes such as phase-locked loops and self-calibration to reach the required timing accuracy.[1][2] The interface uses double pumping (transferring data on both the rising and falling edges of the clock signal) to lower the clock frequency.
Mobile DDR (also known as mDDR, Low Power DDR, or LPDDR) is type of double data rate synchronous DRAM for mobile computers.
Static random-access memory (SRAM) is a type of semiconductor memory where the word static indicates that, unlike dynamic RAM (DRAM), it does not need to be periodically refreshed, as SRAM uses bistable latching circuitry to store each bit. SRAM exhibits data remanence,[1] but is still volatile in the conventional sense that data is eventually lost when the memory is not powered.
The MultiMediaCard (MMC) is a flash memory memory card standard.
Secure Digital (SD) is a non-volatile memory card format developed by the SD Card Association (SDA) for use in portable devices. The SD technology is used by more than 400 brands across dozens of product categories and more than 8,000 models, and is considered the de-facto industry standard.
A SDIO (Secure Digital Input Output) card is a combination of an SD card and an I/O device. This kind of combination is increasingly found in portable electronics devices.
The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern. These pins conduct electrical signals from the integrated circuit to the printed circuit board (PCB) on which it is placed. In a BGA, the pins are replaced by balls ofsolder stuck to the bottom of the package. These solder spheres can be placed manually or with automated equipment. The solder spheres are held in place with a tacky flux until soldering occurs.[1] The device is placed on a PCB with copper pads in a pattern that matches the solder balls. The assembly is then heated, either in a reflow oven or by an infrared heater, causing the solder balls to melt. Surface tension causes the molten solder to hold the package in alignment with the circuit board, at the correct separation distance, while the solder cools and solidifies
Controller–area network (CAN or CAN-bus) is a vehicle bus standard designed to allow microcontrollers and devices to communicate with each other within a vehicle without a host computer.
CAN is a message-based protocol, designed specifically for automotive applications but now also used in other areas such as industrial automation and medical equipment.