03-01-2012, 10:37 PM
15. Money Pad, The Future Wallet
03-01-2012, 10:37 PM
15. Money Pad, The Future Wallet
04-01-2012, 09:30 AM
you can refer these pages to get the details on MONEY PAD THE FUTURE WALLET
https://seminarproject.net/Thread-mo...ure-wallet https://seminarproject.net/Thread-mo...let?page=4 https://seminarproject.net/Thread-mo...3#pid23793 https://seminarproject.net/Thread-mo...?pid=20918 https://seminarproject.net/Thread-mo...llet--5974 https://seminarproject.net/Thread-mo...llet--6940 https://seminarproject.net/Thread-mo...let--12744
04-01-2012, 07:17 PM
artificial immune system
04-01-2012, 08:26 PM
ECE-11 A Technical Paper presentation On [EC 04] BY D.Sairam(05631A0433) D.Satishvarma(05631A0437) ISTE Membership numbers: 1782 &1786 Accredited by NBA ECE-11 1 ECE-11 ABSTRACT ECE-11 2 ECE-11 VLSI Very Large Scale Integrated Circuit Why Design Integrated Circuits? Integrated Circuit (IC) technology is the enabling technology for a whole host of innovative devices and systems that have changed the way we live. Integrated circuits are much smaller and consume less power than the discrete components used to build electronic systems before the 1960s. Integration allows us to build systems with many more transistors, allowing much more computing power to be applied to solving a problem. Integrated circuits are also much easier to design and manufacture and are more reliable than discrete systems; that makes it possible to develop special-purpose systems that are more efficient than general – purpose computers for the task at hand. Components of Chip:- An Integrated Circuit (IC) is a combination of interconnected circuit elements inseparably associated on or within a continuous substrate. The substrate is the supporting material upon or within which an IC is fabricated or to which an IC is attached. ECE-11 3 ECE-11 A monolithic IC is an IC whose elements are formed in place upon or within a semiconductor substrate with at lease one of the elements formed within the substrate. A hybrid IC consists of a combination of two or more IC types or an IC with some discrete elements. A wafer (or slice) is the basic physical unit used in processing. It generally contains a large number of identical ICs, Typically, the wafer is circular; production wafers have a diameter of 4,5 or 6 in. The chip is one of the repeated ICs on a wafer. A typical production wafer may contain as few as 20 or 30 ICs or as many as several hundred or even several thousand, depending upon the complexity and size of the circuit being fabricated. The terms die and bar are used interchangeably for chip in some companies. A test plug, or process control bar (PCB), or process control monitor (PCM), is a special chip that is repeated only a few times on each wafer. It is used to monitor the process parameters of the technology. After processing, the validity of the process is verified by measuring, at the wafer probe level, the characteristics of devices and / or circuits on the test plug. If the measurements of key parameters at the test plug level are not acceptable, the wafer is discarded. Front end construction of components A test cell, or test lead, is a special chip repeated only a few times on each wafer. It differs from the test plug in that the circuit designer includes this cell specifically to monitor the performance of elementary sub circuits or subcomponents
05-01-2012, 02:26 PM
please send the information
Moletronics- an invisible technology please send the information soon
05-01-2012, 06:13 PM
hiii..i need the full details for the topics :
Investigation of the types of handovers in wireless communication system, indoor Positioning,Fuel Cell Vehicle,NIGHT VISION TECHNOLOGY,Wafer Bumping ,Smart Home Technologies,. Radar Tracking System : Concept and Application, Electronic Cooling Systems ,Electronic Paper Display , Blue laser,SMATV system,Electronic Nose
06-01-2012, 10:11 AM
to get information about the topic"wireless communication system," refer the link bellow https://seminarproject.net/Thread-wirele...ull-report
09-01-2012, 02:59 PM
Fpga offloads dsp?s.
Fpga offloads dsp?s.
09-01-2012, 04:56 PM
Fpga offloads dsp?s.
can i get a brief seminar on any of the related topics..pls
09-01-2012, 07:21 PM
Light emitting polymers,nokia-morph-technology,Money Pad, The Future Wallet
10-01-2012, 09:48 AM
to get information about the topic"Light emitting polymers" refer the link bellow https://seminarproject.net/Thread-light-...-lep--4225 https://seminarproject.net/Thread-light-...225?page=2 https://seminarproject.net/Thread-light-...lymers-lep to get information about the topic"nokia-morph-technology" refer the link bellow https://seminarproject.net/Thread-nokia-...technology hi you can refer these pages to get the details on MONEY PAD THE FUTURE WALLET https://seminarproject.net/Thread-mo...ure-wallet https://seminarproject.net/Thread-mo...let?page=4 https://seminarproject.net/Thread-mo...3#pid23793 https://seminarproject.net/Thread-mo...?pid=20918 https://seminarproject.net/Thread-mo...llet--5974 https://seminarproject.net/Thread-mo...llet--6940 https://seminarproject.net/Thread-mo...let--12744
20-01-2012, 02:38 PM
send me full seminar report on RFID Radio Frequency Identification
20-01-2012, 04:52 PM
What is Cryptography
22-01-2012, 11:03 AM
hi bro,
pls mail me detailed reports on >DNA based computers >Digital scent technology are these topics based on ieee reports
22-01-2012, 03:43 PM
seminor presentation on Heloi display
hai, pls send seminor presentation on finger print control system in offices |
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