24-08-2012, 02:50 PM
New 1200V Integrated Circuit Changes The Way 3-Phase Motor Drive Inverters Are Designed
1New 1200V Integrated Circuit.pdf (Size: 316.66 KB / Downloads: 206)
Introduction
Variable frequency drive (VFD) is an essential
element of energy saving, variable speed inverter
drives for AC induction, AC synchronous,
brushless DC and AC motors. To a large extent,
power conversion components determine the efficiency,
size, ruggedness and manufacturing cost
of the VFD inverter.
1200V HVIC Technology
A monolithic high voltage integrated circuit
(HVIC) technology is required to integrate all the
circuits that drive and protect high voltage
MOSFETs or IGBTs in
a high side or bridge topology. A 600V rating is
required for inverter designs operating from 200-
230VAC and a 1200V rating is required for
460VAC. Such an HVIC technology requires integration
of
analog control circuits and high voltage level shifting
devices together with the capability of the analog
circuits operating from a floating supply rail
that can move around from below ground to above
the high voltage DC bus.
1200V Three-Phase Gate Drive IC
A new architecture for the gate drive
circuits of a 460VAC three-phase inverter is
created by using the 1200V HVIC
technology. The first product is the IR2233
that provides in a single chip all the circuits
necessary to interface between the
microcontroller and the three-phase IGBT
power stage. The block diagram and the
application circuit for the IR2233 driving a
three-phase IGBT inverter stage is shown in
Figure 4. A functional and pin compatible
600V version, IR2133, is also available for
200-230VAC three-phase inverter designs.
The die plots for the 1200V IR2233 and
600V IR2133 are shown in Figure 5.
POWIRTRAIN Integrated Power Stage
The IR2233 had been successfully
implemented in an integrated power stage
(called the POWIRTRAIN IRPT2051) for a
460VAC, 3-HP motor (Figure 9). The
1200V rated power module includes
three-phase rectifier, brake IGBT and
freewheeling diode, three-phase IGBT
inverter stage, high and low rails 25mW low
inductance current shunts and positive
temperature coefficient thermistor (PTC). All
the power components are housed inside a
compact epoxy encapsulated case with an
injection molded shell and leadframe casing.
The bottom plate, composed of the back of
an insulated metal substrate (IMS), provides
mating surface with a heat sink. The driver
board operates with the power module and it
contains the IR2233 gate drive circuit,
protection circuit, feedback signals, brake
function and local power supply.
Compared to a discrete implementation.