10-12-2012, 11:11 AM
PCB designing and fabrication
PCB designing and fabrication.docx (Size: 1.15 MB / Downloads: 28)
Theory
What is PCB ?
A PCB is a printed circuit board, also known as a printed wiring board. It is used in electronics to build electronic devices. A PCB serves two purposes in the construction of an electronic device; it is a place to mount the components and it provides the means of electrical connection between the components.
History
The inventor of the printed circuit was the Austrian engineer Paul Eisler (1907–1995) who, while working in England,made one circa 1936 as part of a radio set.
Material:
Conducting layers are typically made of thin copper foil. Insulating layers dielectric are typically laminated together with epoxy resin prepreg. The board is typically coated with a solder mask that is green in color. Other colors that are normally available are blue and red. There are quite a few different dielectrics that can be chosen to provide different insulating values depending on the requirements of the circuit. Some of these dielectrics are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1 or CEM-3. Well known prepreg materials used in the PCB industry are FR-2 (Phenolic cotton paper), FR-3 (Cotton paper and epoxy), FR-4 (Woven glass and epoxy), FR-5 (Woven glass and epoxy), FR-6(Matte glass and polyester), G-10(Woven glass and epoxy), CEM-1 (Cotton paper and epoxy), CEM-2 (Cotton paper and epoxy), CEM-3 (Woven glass and epoxy),CEM-4 (Woven glass and epoxy), CEM-5 (Woven glass and polyester). Thermal expansion is an important consideration especially with BGA and naked die technologies, and glass fiber offers the best dimensional stability.
Patterning(etching)
The vast majority of printed circuit boards are made by bonding a layer of copper over the entire substrate, sometimes on both sides, (creating a "blank PCB") then removing unwanted copper after applying a temporary mask (e.g. by etching), leaving only the desired copper traces. A few PCBs are made by adding traces to the bare substrate (or asubstrate with a very thin layer of copper) usually by a complex process of multiple electroplating steps. The PCBmanufacturing method primarily depends on whether it is for production volume or sample/prototype quantities. PCB milling uses a two or three- axis mechanical milling system to mill away the copper foil from the substrate. A PCB milling machine (referred to as a 'PCB Prototyper') operates in a similar way to a plotter, receiving commands from the host software that control the position of the milling head in the x, y, and (if relevant) z axis. Data to drive the Prototyper is extracted from files generated in PCB design software and stored in HPGL or Gerber file format.
Etching
Chemical etching is done with ferric chloride, ammonium persulfate, or sometimes hydrochloric acid.For PTH (plated-through holes), additional steps of electroless deposition are done after the holes are drilled, then copper is electroplated to build up the thickness, the boards are screened, and plated with tin/lead. The tin/lead becomes the resist leaving the bare copper to be etched away.
Lamination
Some PCBs have trace layers inside the PCB and are called multi-layer PCBs. These are formed by bonding together separately etched thin boards.
Drilling
Holes through a PCB are typically drilled with tiny drill bits made of solid tungsten carbide. The drilling is performed by automated drilling machines with placement controlled by a drill tape or drill file. These computer-generated files are also called numerically controlled drill (NCD) files or "Excellon files". The drill file describes the location and size of eachdrilled hole. These holes are often filled with annular rings (hollow rivets) to create vias. Vias allow the electrical and thermal connection of conductors on opposite sides of the PCB.Most common laminate is epoxy filled fiberglass. Drill bit wear is partly due to embedded glass, which is harder than steel. High drill speed necessary for cost effectivedrilling of hundreds of holes per board causes very high temperatures at the drill bit tip, and high temperatures (400-700 degrees) soften steel and decompose (oxidize) laminate filler. Copper is softer than epoxy and interior conductors may suffer.
damage during drilling
When very small vias are required, drilling with mechanical bits is costly because of high rates of wear and breakage. In this case, the vias may be evaporated by lasers. Laser-drilled vias typically have an inferior surface finish inside thehole. These holes are called micro vias.It is also possible with controlled-depth drilling, laser drilling, or by pre-drillingthe individual sheets of the PCB before lamination, to produce holes that connect only some of the copper layers, rather than passing through the entire board. These holes are called blind vias when they connect an internal copper layer to an outer layer, or buried vias when they connect two or more internal copper layers and no outer layers.The walls of the holes, for boards with 2 or more layers, are made conductive then plated with copper to form plated-through holes that electrically connect the conducting layers of the PCB. For multilayer boards, those with 4 layers or more, drilling typically produces a smear of the high temperature decomposition products of bonding agent in the laminate system. Before the holes can be plated through, this smear must be removed by a chemical de-smear process, or by plasma-etch.Removing(etching back) the smear also reveals the interior conductors as well.
Exposed conductor plating and coating
PCBs are plated with solder, tin, or gold over nickel as a resist for etching away the unneeded underlying copper.After PCBs are etched and then rinsed with water, the soldermask is applied, and then any exposed copper is coated with solder, nickel/gold, or some other anti-corrosion coating.Matte solder is usually fused to provide a better bonding surface or stripped to bare copper. Treatments, such as benzimidazolethiol, prevent surface oxidation of bare copper. The places to which components will be mounted are typically plated, because untreated bare copper oxidizes quickly, and therefore is not readily solderable. Traditionally, any exposed copper was coated with solder by Hot air solder levelling (HASL). This solder was a tin-lead alloy, however new solder compounds are now used to achieve compliance with the RoHS directive in the EU and US, which restricts the use of lead. One of these lead-free compounds is SN100CL, made up of 99.3% tin, 0.7% copper, 0.05% nickel, and a nominal of 60ppm germanium.It is important to use solder compatible with both the PCB and the parts used. An example is Ball Grid Array (BGA) using tin-lead solder balls for connections losing their balls on bare copper traces or using lead-free solder paste.Other platings used are OSP (organic surface protectant), immersion silver (IAg), immersion tin, electroless nickel with immersion gold coating (ENIG), and direct gold plating (over nickel). Edge connectors, placed along one edge of some boards, are often nickel plated then gold plated. Another coating consideration is rapid diffusion of coating metal into Tin solder. Tin forms intermetallics such as Cu5Sn6 and Ag3Cu that dissolve into the Tin liquidus or solidus(@50C), stripping surface coating and/or leaving voids.