29-06-2013, 04:30 PM
SFO TECHNOLOGIES – A NeST GROUP COMPANY
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INTRODUCTION
NeST Group is a highly diversified business conglomerate, operating in the areas of manufacturing services, products and technologies, engineering, software and system integration. It is a global corporation operating in the IT Sector providing hardware and software solutions to customers worldwide.
SFO Technologies is a knowledgeable and trustworthy partner that develops long-term relationships with its clients and guides them through processes that define the most effective solutions to meet their needs. Whether projects are completed solely at clients' sites or by utilizing in-house facilities, clients benefit from the company's pricing structures. The project models, including time and materials, turn-key operations, dedicated staffing plans, joint ventures, and structured R&D ensure that we can comply with any business scenario.
COMPANY PROFILE
SFO Technologies, a NeST Group Company is an International Corporate group, of over 25 companies employing more than 3500 people worldwide, has a global export business turnover in excess of $ 200 million. The Group has a strong presence in futuristic Computer & Communication technology areas like Networking, Fiber Optics, RF & Microwave and Software. SFO Technologies has many hardware and software facilities spread across Trivandrum, Cochin, Bangalore and Mysore in India and in the USA.
ABOUT SFO TECHNOLOGIES
The SFO Technologies, a NeST Group Company is a highly diversified business conglomerate, operating in the areas of Manufacturing Services, Products and Technologies, Engineering Software and Systems Integration. The group has its presence across the globe. SFO was established on 1991. SFO Technologies, a NeST Group Company is an International Corporate group, of over 25 companies employing more than 3500 people worldwide, has a global export business turnover in excess of $200 million.
SFO OPERATIONS
SFO Technologies' products and services are available in diverse technology fields such as Embedded Software, Middleware, Applications, Digital Electronics, RF & Wireless, Wire harness, Power Supplies, Fiber Optics and Optronics and mechanical/plastic packaging. SFO Technologies has innovative products, services and solutions to markets like Healthcare, Communication, Industrial and Transportation. The group offers turnkey solutions, product development and maintenance, R&D support, and custom services spanning diverse domains and technologies such as Embedded System Development, including hardware design and product development, Industrial and Process Automation, Consumer Electronics, Medical Instrumentation, Broadband Network Management Solutions, Multimedia and Networking, Security Solutions, Business Software and Client-server and Groupware applications. The company has development centers located at Trivandrum, Cochin and Bangalore in India besides front-end operations on all continents.
WAVE SOLDERING FACILITY
Wave soldering is a large-scale soldering process by which electronic components are soldered to a printed circuit board (PCB) to form an electronic assembly. The name is derived from the use of waves of molten solder to attach metal components to the PCB. The process uses a tank to hold a quantity of molten solder, the components are inserted into or placed on the PCB and the loaded PCB is passed across a pumped wave or waterfall of solder. The solder wets the exposed metallic areas of the board (those not protected with solder mask, a protective coating that prevents the solder from bridging between connections), creating a reliable mechanical and electrical connection. The process is much faster and can create a higher quality product than manual soldering of components.
Wave soldering is used for both through-hole printed circuit assemblies, and surface mount. In the latter case, the components are glued by the placement equipment onto the printed circuit board surface before being run through the molten solder wave. As through-hole components have been largely replaced by surface mount components, wave soldering has been supplanted by reflow soldering methods in many large-scale electronics applications.
LARGE VOLUME ASSEMBLY LINE
Surface mount technology (SMT) is a method for constructing electronic circuits in which the components (SMC or Surface Mounted Components) are mounted directly onto the surface of printed circuit boards (PCBs). Electronic devices so made are called surface mount devices or SMDs. An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, and a matrix of solder balls (BGAs), or terminations on the body of the component.
Reflow soldering is the most common method of attaching surface mount components to a circuit board. The goal of the reflow process is to melt the solder and heat the adjoining surfaces, without overheating and damaging the electrical components. Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or several electrical components to their contact pads, after which the entire assembly is subjected to controlled heat, which melts the solder, permanently connecting the joint. Heating may be accomplished by passing the assembly through a reflow oven or under an infrared lamp or by soldering individual joints with a hot air pencil.
PCBA ICTs
In-circuit test (ICT) is an example of white box testing where an electrical probe tests a populated printed circuit board (PCB), checking for shorts, opens, resistance, capacitance, and other basic quantities which will show whether the assembly was correctly fabricated. It may be performed with a bed of nails type test fixture and specialist test equipment, or with a fixtureless in-circuit test setup.
While in-circuit test is a very powerful tool for testing PCBs, it has these limitations:
• Parallel components can only be tested as one component if the component is same, but different component in parallel connection sometimes can be tested for each component in different testing method.
• Electrolytic components can be tested for polarity only on specific configuration (e.g. if not parallel connected to power rails) or with specific sensor.
• The quality of electrical contacts cannot be tested.
• It is only as good as the design of the PCB. If no test access has been provided by the PCB designer then some tests will not be possible.
CHIP ON BOARD INSPECTION
PCB Inspection (Printed Circuit Board Inspection) or SMT Inspection (Surface Mount Technology Inspection) is necessary to detect and isolate process defects on the top of a circuit board. PCB inspection look for a variety of defects during process development or the quality process, including Cracked Solder Joints, Excess Flux, BGA Separation, Bridging, Cold Solder Joints ,Solder Pads, Contamination, Empty and Open, Improper Solder Paste, Replacement, Joint Cracking etc. Wire bonds can be analyzed with visual X-ray methods .At 0 angle of X-ray transmission, both short and open wires are discernable for inspection.