28-06-2012, 12:47 PM
Nano composites
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The Embedded Passive Advantage
Electronic technologies that allow for a reduction in size, weight, and cost while
improving functionality and performance are highly desired for military and
commercial applications, including telecommunications, network systems,
automotive, and computer electronic devices. The architecture of passive
components is one area with room for improvement due to the large and growing
number of passive components in today’s increasingly functional devices. Discrete
passives, especially capacitors, have already become the major barrier of the
electronic systems miniaturization. Therefore, the development of embedded
passives is desired, if not required. Among passive components, the development of
embedded capacitors has been an area of significant activity because of capacitor
use in multiple functions, such as decoupling, by-passing, filtering, and timing
capacitors.
Artificial Dielectric Nanocomposites
The Company. nGimat, located inside the perimeter of Atlanta, is an intellectual property and manufacturing company that
engineers nanopowders, thin films, and devices. Our facilities are equipped with instrumentation to perform cutting edge
materials research, development, and manufacturing. The scientists and engineers at nGimat bring backgrounds in materials
science, chemistry, physics, mechanical/chemical/electrical engineering, and biochemistry to the challenges of engineering
nanomaterials. In addition, our analytical personnel provide rapid turn-around times and state-of-the-art materials analysis to
support our materials development.
nGimat offers its customers product sales, license arrangements, and R&D services, including research and development
services f or emerging technologies; sale of CCVD coating equipment in association with customer alliances; and licensing
under strategic alliances and joint ventures of CCVD process and advanced material technology.
Metal-filled polymer composites (“artificial dielectrics”) have the potential to address the needs of emerging dielectric
technologies, such as embedded capacitors with high capacitive densities (20-200 nF/cm2). In an applied field, dipoles form in
each of the metal particles, resulting in polarization that simulates a true dielectric. For high frequency applications, engineering
small particles with high electron mobilities is essential since only these properties will enable the rapid field response
necessary for high dielectric constant and low loss. These new nanocomposite artificial dielectrics have the potential to have
high dielectric constants (> 100) at high frequencies and to enable the low temperature processing associated with polymers.
This combination of properties is not found in other capacitor materials.
Size and cost of electronic components is expected to decrease by an order of magnitude in this decade. To accomplish these
goals, it is necessary to integrate many of the passive components. By incorporating capacitors within the board structure,
significant miniaturization of the electronic device can be achieved. Embedding capacitors within the board also has the
potential to increase performance by shortening conductive paths, improve reliability by decreasing the number of solder joints,
and lower cost. However, the embedded capacitor concept does not come without challenges.