20-10-2014, 04:20 PM
The project relates to developing a laser assisted machining process for the hard and the brittle materials like ceramics and semiconductors.The basic idea was to incorporate the laser through the tool and machining by the simultaneous application of pressure that results in High Pressure Phase Transformation (HPPT) and ductile regime machining .The machine setup was designed.analysis was then carried out for Si I,Si II and 3C-SiC for different laser wavelengths of 500nm,1000nm and 1500nm.Finally,simulations were carried out to determine the optimum value for different machining parameters.The project was done under the guidance of Professor and Chair Dr.John A.Patten,WMU