18-06-2014, 02:49 PM
3D VLSI PACKAGING TECHNOLOGY
[attachment=65024]
WHAT IS MCM
MCM is a structure in which a packaging efficiency of greater than 30% is achieved.
SOLDER EDGE CONDUCTORS
It is a process where vertical interconnections between ICs are performed by soldering.
Solder dipped stacks to create vertical conductors on edge
Solder-filled holes in chip carriers and spacers
Solder connections between plated through-hole
CONCLUSION
As a result, it is believed that 3D technology is now sufficiently mature to enable the successful development and implementation of a 3D demonstration device, which is one of the goals of this program. This is discussed as part of a research and development plan in the accompanying Plan document, and will feed into the DSTO long term strategic planning for design and development of systems that have requirements that can not be meet using conventional packaging techniques.
[attachment=65024]
WHAT IS MCM
MCM is a structure in which a packaging efficiency of greater than 30% is achieved.
SOLDER EDGE CONDUCTORS
It is a process where vertical interconnections between ICs are performed by soldering.
Solder dipped stacks to create vertical conductors on edge
Solder-filled holes in chip carriers and spacers
Solder connections between plated through-hole
CONCLUSION
As a result, it is believed that 3D technology is now sufficiently mature to enable the successful development and implementation of a 3D demonstration device, which is one of the goals of this program. This is discussed as part of a research and development plan in the accompanying Plan document, and will feed into the DSTO long term strategic planning for design and development of systems that have requirements that can not be meet using conventional packaging techniques.