07-07-2012, 01:29 PM
A COMPACT HTS DUPLEXER FOR COMMUNICATION APPLICATION
[attachment=27120]
INTRODUCTION
To split the input frequencies into two separate
bands or inversely.
Used in RF and microwave communication
systems, such as mobile and satellite
communication systems.
Advantage of compact size,lighter weight and
easier to integrate with other circuits.
HTS technologyreduces
mass and volume.
BANDSTOP FILTER
For rejection around 2840 MHz,
1) Increasing the pole of the bandpass filters
2) Linking a bandstop filter to the output port
3) Adding a bandstop filter to the input port
42 × 26 mm size (40% of ref.)
FABRICATION AND EXPERIMENTAL RESULTS
Fabricated using 2in
doublesided
YBCO thin film
on 0.5mmthick
LaAlO3 substrate.
YBCO thin film600nm
thickness & characterestic
temp about 89K
Photolithography, ionbeam
etching, and wafer
dicing.
The wafer was assembled into a brass housing with
the whole dimension 51 × 35 × 14 mm.
CONCLUSION
A compact HTS duplexer with a size of 42 × 26mm
High specifications such as insertion loss,frequency
range,outofband
rejection, VSWR,high channel
isolation,and band edge steepness (21 dB/MHz)
Deep outofband
rejection (more than 75 dB) up to
3 GHz
Successfully suppressing second harmonic response
High channel isolation (more than 80 dB) was
achieved with effective screening.
[attachment=27120]
INTRODUCTION
To split the input frequencies into two separate
bands or inversely.
Used in RF and microwave communication
systems, such as mobile and satellite
communication systems.
Advantage of compact size,lighter weight and
easier to integrate with other circuits.
HTS technologyreduces
mass and volume.
BANDSTOP FILTER
For rejection around 2840 MHz,
1) Increasing the pole of the bandpass filters
2) Linking a bandstop filter to the output port
3) Adding a bandstop filter to the input port
42 × 26 mm size (40% of ref.)
FABRICATION AND EXPERIMENTAL RESULTS
Fabricated using 2in
doublesided
YBCO thin film
on 0.5mmthick
LaAlO3 substrate.
YBCO thin film600nm
thickness & characterestic
temp about 89K
Photolithography, ionbeam
etching, and wafer
dicing.
The wafer was assembled into a brass housing with
the whole dimension 51 × 35 × 14 mm.
CONCLUSION
A compact HTS duplexer with a size of 42 × 26mm
High specifications such as insertion loss,frequency
range,outofband
rejection, VSWR,high channel
isolation,and band edge steepness (21 dB/MHz)
Deep outofband
rejection (more than 75 dB) up to
3 GHz
Successfully suppressing second harmonic response
High channel isolation (more than 80 dB) was
achieved with effective screening.