17-07-2012, 03:52 PM
Thermoelectric Cooling Devices
[attachment=27836]
Abstract:-
This presentation describes a novel integrated circuit technology to manufacture high density thermoelectric
devices on a semiconductor wafer.
With no moving parts, a thermoelectric cooler operates quietly, allows cooling below ambient temperature.
This may be used for temperature control or heating if
the direction of current flow is reversed.
Introduction:-
Thermoelectric cooling uses the Peltier effect to create a heat flux between the junction of two different types of materials.
Thermoelectric coolers are solid state heat pumps when direct current runs through it, heat is moved from one side to the other.Therefore it can be used either for heating or for cooling.
Traditional thermal technology:-
The International Technology Roadmap for Semiconductors predicts that power dissipation and thermal problems are major design challenges to continued scaling.
To meet the power demand of each application, today’s prevailing cooling technologies can be divided into 4 categories:
1.Natural air convection,
2.Forced air convection,
3.Fluid phase change
4.Liquid cooling.
Processing Steps to Form Thermoelectric Array:-
The heat pumping capacity of a thermoelectric cooling module can be improved by increasing the number of thermoelectric couple elements and arrays.
Therefore, the reduction of the feature sizes of thermoelectric couple elements using advanced thin-film material and technologies will lead to significant improvement in the heat pumping capacity.
In this section, we propose a new technology to form thermoelectric (TE) couple elements on a bulk silicon or SOI substrate.
Disadvantages:-
Its main disadvantage is that it cannot simultaneously have low cost and high power efficiency.
Many researchers and companies are trying to develop Peltier coolers that are both cheap and efficient.
[attachment=27836]
Abstract:-
This presentation describes a novel integrated circuit technology to manufacture high density thermoelectric
devices on a semiconductor wafer.
With no moving parts, a thermoelectric cooler operates quietly, allows cooling below ambient temperature.
This may be used for temperature control or heating if
the direction of current flow is reversed.
Introduction:-
Thermoelectric cooling uses the Peltier effect to create a heat flux between the junction of two different types of materials.
Thermoelectric coolers are solid state heat pumps when direct current runs through it, heat is moved from one side to the other.Therefore it can be used either for heating or for cooling.
Traditional thermal technology:-
The International Technology Roadmap for Semiconductors predicts that power dissipation and thermal problems are major design challenges to continued scaling.
To meet the power demand of each application, today’s prevailing cooling technologies can be divided into 4 categories:
1.Natural air convection,
2.Forced air convection,
3.Fluid phase change
4.Liquid cooling.
Processing Steps to Form Thermoelectric Array:-
The heat pumping capacity of a thermoelectric cooling module can be improved by increasing the number of thermoelectric couple elements and arrays.
Therefore, the reduction of the feature sizes of thermoelectric couple elements using advanced thin-film material and technologies will lead to significant improvement in the heat pumping capacity.
In this section, we propose a new technology to form thermoelectric (TE) couple elements on a bulk silicon or SOI substrate.
Disadvantages:-
Its main disadvantage is that it cannot simultaneously have low cost and high power efficiency.
Many researchers and companies are trying to develop Peltier coolers that are both cheap and efficient.