28-09-2012, 12:03 PM
Cyclone II Device Handbook
[attachment=34682]
Introduction
Following the immensely successful first-generation Cyclone™ device
family, Altera® Cyclone II FPGAs extend the low-cost FPGA density
range to 68,416 logic elements (LEs) and provide up to 622 usable I/O
pins and up to 1.1 Mbits of embedded memory. Cyclone II FPGAs are
manufactured on 300-mm wafers using TSMC's 90-nm low-k dielectric
process to ensure rapid availability and low cost. By minimizing silicon
area, Cyclone II devices can support complex digital systems on a single
chip at a cost that rivals that of ASICs. Unlike other FPGA vendors who
compromise power consumption and performance for low-cost, Altera’s
latest generation of low-cost FPGAs —Cyclone II FPGAs, offer 60 percent
higher performance and half the power consumption of competing
90-nm FPGAs. The low cost and optimized feature set of Cyclone II
FPGAs make them ideal solutions for a wide array of automotive,
consumer, communications, video processing, test and measurement,
and other end-market solutions. Reference designs, system diagrams,
and IP, found at www.Altera.com, are available to help you rapidly
develop complete end-market solutions using Cyclone II FPGAs.
Low-Cost Embedded Processing Solutions
Cyclone II devices support the Nios II embedded processor which allows
you to implement custom-fit embedded processing solutions. Cyclone II
devices can also expand the peripheral set, memory, I/O, or performance
of embedded processors. Single or multiple Nios II embedded processors
can be designed into a Cyclone II device to provide additional
co-processing power or even replace existing embedded processors in
your system. Using Cyclone II and Nios II together allow for low-cost,
high-performance embedded processing solutions which allow you to
extend your product's life cycle and improve time to market over
standard product solutions
Functional Description
Cyclone™ II devices contain a two-dimensional row- and column-based
architecture to implement custom logic. Column and row interconnects of
varying speeds provide signal interconnects between logic array blocks
(LABs), embedded memory blocks, and embedded multipliers.
The logic array consists of LABs, with 16 logic elements (LEs) in each
LAB. An LE is a small unit of logic providing efficient implementation of
user logic functions. LABs are grouped into rows and columns across the
device. Cyclone II devices range in density from 4,608 to 68,416 LEs.
Cyclone II devices provide a global clock network and up to four
phase-locked loops (PLLs). The global clock network consists of up to 16
global clock lines that drive throughout the entire device. The global clock
network can provide clocks for all resources within the device, such as
input/output elements (IOEs), LEs, embedded multipliers, and
embedded memory blocks. The global clock lines can also be used for
other high fan-out signals. Cyclone II PLLs provide general-purpose
clocking with clock synthesis and phase shifting as well as external
outputs for high-speed differential I/O support.
LAB Interconnects
The LAB local interconnect can drive LEs within the same LAB. The LAB
local interconnect is driven by column and row interconnects and LE
outputs within the same LAB. Neighboring LABs, PLLs, M4K RAM
blocks, and embedded multipliers from the left and right can also drive
an LAB’s local interconnect through the direct link connection. The direct
link connection feature minimizes the use of row and column
interconnects, providing higher performance and flexibility. Each LE can
drive 48 LEs through fast local and direct link interconnects. Figure 2–6
shows the direct link connection.
[attachment=34682]
Introduction
Following the immensely successful first-generation Cyclone™ device
family, Altera® Cyclone II FPGAs extend the low-cost FPGA density
range to 68,416 logic elements (LEs) and provide up to 622 usable I/O
pins and up to 1.1 Mbits of embedded memory. Cyclone II FPGAs are
manufactured on 300-mm wafers using TSMC's 90-nm low-k dielectric
process to ensure rapid availability and low cost. By minimizing silicon
area, Cyclone II devices can support complex digital systems on a single
chip at a cost that rivals that of ASICs. Unlike other FPGA vendors who
compromise power consumption and performance for low-cost, Altera’s
latest generation of low-cost FPGAs —Cyclone II FPGAs, offer 60 percent
higher performance and half the power consumption of competing
90-nm FPGAs. The low cost and optimized feature set of Cyclone II
FPGAs make them ideal solutions for a wide array of automotive,
consumer, communications, video processing, test and measurement,
and other end-market solutions. Reference designs, system diagrams,
and IP, found at www.Altera.com, are available to help you rapidly
develop complete end-market solutions using Cyclone II FPGAs.
Low-Cost Embedded Processing Solutions
Cyclone II devices support the Nios II embedded processor which allows
you to implement custom-fit embedded processing solutions. Cyclone II
devices can also expand the peripheral set, memory, I/O, or performance
of embedded processors. Single or multiple Nios II embedded processors
can be designed into a Cyclone II device to provide additional
co-processing power or even replace existing embedded processors in
your system. Using Cyclone II and Nios II together allow for low-cost,
high-performance embedded processing solutions which allow you to
extend your product's life cycle and improve time to market over
standard product solutions
Functional Description
Cyclone™ II devices contain a two-dimensional row- and column-based
architecture to implement custom logic. Column and row interconnects of
varying speeds provide signal interconnects between logic array blocks
(LABs), embedded memory blocks, and embedded multipliers.
The logic array consists of LABs, with 16 logic elements (LEs) in each
LAB. An LE is a small unit of logic providing efficient implementation of
user logic functions. LABs are grouped into rows and columns across the
device. Cyclone II devices range in density from 4,608 to 68,416 LEs.
Cyclone II devices provide a global clock network and up to four
phase-locked loops (PLLs). The global clock network consists of up to 16
global clock lines that drive throughout the entire device. The global clock
network can provide clocks for all resources within the device, such as
input/output elements (IOEs), LEs, embedded multipliers, and
embedded memory blocks. The global clock lines can also be used for
other high fan-out signals. Cyclone II PLLs provide general-purpose
clocking with clock synthesis and phase shifting as well as external
outputs for high-speed differential I/O support.
LAB Interconnects
The LAB local interconnect can drive LEs within the same LAB. The LAB
local interconnect is driven by column and row interconnects and LE
outputs within the same LAB. Neighboring LABs, PLLs, M4K RAM
blocks, and embedded multipliers from the left and right can also drive
an LAB’s local interconnect through the direct link connection. The direct
link connection feature minimizes the use of row and column
interconnects, providing higher performance and flexibility. Each LE can
drive 48 LEs through fast local and direct link interconnects. Figure 2–6
shows the direct link connection.