16-10-2012, 11:04 AM
STRUCTURE OF B.E. (ELECTRONICS & TELECOMMUNICATIONS) SYLLABUS
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ELECTRONIC PRODUCT DESIGN (404181)
Unit 1: Introduction
Stages in product design- Market survey, Product Specifications (Electrical, Mechanical, Environmental), R&D and Engineering Prototypes, Pilot Production Batch, Environmental testing, Documentation, Manufacturing. Electronic Products Classification- Consumer, Industrial and Military. Their peculiarities in terms of Cost/performance ratio and Reliability. Reliability- Bath tub curve, Measures taken (at Component and Product level and various soldering techniques including Surface Mount Technology) to improve reliability. Fundamentals of Communication System Design, criteria for selection of frequency bands, requirements of Voice and Multimedia Applications
Unit 2: Hardware designs- Analog
Analog Signal Conditioning- Factors affecting choice of OPAMPs in signal conditioning applications. Need for Instrumentation Amplifiers- Case study. Error budget analysis with Case study. ADCs- Interpretation of ADC specifications from design view point. Considerations in selecting References (Vref for ADC).DACs- Interpretation of DAC specifications from design view point.
Unit 3: Hardware design- Digital
Interface examples for- LED, HB LED, LCD, Keyboard, Touch Screen. Microcontrollers- Comparative study of different Microcontroller Architectures, Factors affecting choice of Microcontroller for particular application with Case study of one application. Introduction to buses and protocols used in Electronic Products- I2C, SPI.
Unit 4: Software design and testing for Electronic Product
Different approaches to development of application software for Electronic Product. Factors affecting choice between Assembly language and High level language like C and C++. Documentation practices and templates for above software.Debugging tools and techniques for software- Features and limitations of- Debuggers, Simulators, ICE, IDE. Hardware Test Programs.
Unit 5: PCB design and EMI/EMC
PCB Design practices for Analog and Mixed signal circuits- Ground Loops, Precision circuits, shielding and guarding. PCB Design Practices for High Speed Digital Circuits, Signal integrity and EMC. EMI/EMC testing standards and compliance.
Unit 6: Design Considerations of Communication Systems
Implementing Radio link, Path profile. RF path loss calculations, Transmitter/Receiver sensitivity, Signal to Noise Ratio and SINAD, Fade Margin. Study and evaluation of Performance parameters like- Bit and Symbol error rates. Spectral bandwidth calculations. Design of various blocks of communication systems such as- Phase-locked Loop, Equalizer and Interleaver.
VLSI DESIGN AND TECHNOLOGY (404182)
Unit 1: Analog CMOS Design
Enhancement MOSFET equivalent circuit, parasitics, as resistor, diode. Active load, current source and push pull inverter amplifiers. Current source and sink. Common source, drain and gate amplifiers. Cascode amplifier. Differential amplifier. CMOS op-amp.
Unit 2: Digital CMOS Design
CMOS Inverter, voltage transfer curve, body effect, hot electron effect, velocity saturation. Static and dynamic dissipations. Power delay product. Noise margin. Combinational logic design, W/L calculations. Transmission gate, design using TGs. λ parameter, layout, Design Rule Check. Technology scaling.
Unit 3: VHDL and Finite State Machines
VHDL design units, modeling styles, synthesizable and non synthesizable test benches, design flow, functions, procedures, attributes, test benches, configurations, packages. Synchronous and asynchronous machines, Finite State Machines (FSM), metastability, state diagrams and VHDL codes for FSMs.
Unit 4: Programmable Logic Devices (PLDs)
Need of PLDs. Comparison with ASIC, general purpose processor, DSP processor, microcontroller, memories etc. Features, specifications, detail architectures, application areas, limitations of Complex Programmable Logic Device (CPLD) and Field Programmable Logic Devices (FPGA).
Unit 5: Fault tolerance and testability
Types of fault, stuck open, short, stuck at 1, 0 faults. Fault coverage. Need of Design for Testability (DFT). Controllability, predictability, testability, Built In Self Test (BIST). Partial and full scan check. Need of boundary scan check, JTAG, Test Access Port (TAP) controller.
COMPUTER NETWORK (404183)
Unit 1: Physical Layer
Data Communications, Networks, Networks models, OSI model, Layers in OSI model, TCP / IP protocol suite, Addressing, Guided and Unguided Transmission media. Switching: Circuit switched networks, Data gram Networks, Virtual circuit networks. Cable networks for Data transmission: Dialup modems, DSL, Cable TV, Cable TV for Data transfer.
Unit 2: Data Link Layer
Data link control: Framing, Flow and error control, Protocols for Noiseless and Noisy Channels, HDLC. Multiple access: Random access, Controlled access. Wired LANS : Ethernet, IEEE standards, standard Ethernet, changes in the standard, Fast Ethernet, Gigabit Ethernet.
Unit 3: Wireless LANS
Wireless LANS : IEEE 802.11–Bluetooth. Connecting LANS: Connecting devices, Backbone networks, Virtual LANS. Virtual circuit networks: Architecture and Layers of Frame Relay and ATM.
Unit 4: Network Layer
Logical addressing: IPv4, IPv6 addresses. Internet Protocol: Internetworking- IPv4, IPv6 - Address mapping- ARP, RARP,BOOTP, DHCP, ICMP, IGMP, Delivery- Forwarding , Routing -Unicast, Multicast routing protocols.
Unit 5: Transport Layer
Process-to-Process delivery, User Datagram Protocol (UDP), Transmission Control, Protocol (TCP), Congestion Control, Quality of services (QoS), Techniques to improve QoS.
[attachment=36463]
ELECTRONIC PRODUCT DESIGN (404181)
Unit 1: Introduction
Stages in product design- Market survey, Product Specifications (Electrical, Mechanical, Environmental), R&D and Engineering Prototypes, Pilot Production Batch, Environmental testing, Documentation, Manufacturing. Electronic Products Classification- Consumer, Industrial and Military. Their peculiarities in terms of Cost/performance ratio and Reliability. Reliability- Bath tub curve, Measures taken (at Component and Product level and various soldering techniques including Surface Mount Technology) to improve reliability. Fundamentals of Communication System Design, criteria for selection of frequency bands, requirements of Voice and Multimedia Applications
Unit 2: Hardware designs- Analog
Analog Signal Conditioning- Factors affecting choice of OPAMPs in signal conditioning applications. Need for Instrumentation Amplifiers- Case study. Error budget analysis with Case study. ADCs- Interpretation of ADC specifications from design view point. Considerations in selecting References (Vref for ADC).DACs- Interpretation of DAC specifications from design view point.
Unit 3: Hardware design- Digital
Interface examples for- LED, HB LED, LCD, Keyboard, Touch Screen. Microcontrollers- Comparative study of different Microcontroller Architectures, Factors affecting choice of Microcontroller for particular application with Case study of one application. Introduction to buses and protocols used in Electronic Products- I2C, SPI.
Unit 4: Software design and testing for Electronic Product
Different approaches to development of application software for Electronic Product. Factors affecting choice between Assembly language and High level language like C and C++. Documentation practices and templates for above software.Debugging tools and techniques for software- Features and limitations of- Debuggers, Simulators, ICE, IDE. Hardware Test Programs.
Unit 5: PCB design and EMI/EMC
PCB Design practices for Analog and Mixed signal circuits- Ground Loops, Precision circuits, shielding and guarding. PCB Design Practices for High Speed Digital Circuits, Signal integrity and EMC. EMI/EMC testing standards and compliance.
Unit 6: Design Considerations of Communication Systems
Implementing Radio link, Path profile. RF path loss calculations, Transmitter/Receiver sensitivity, Signal to Noise Ratio and SINAD, Fade Margin. Study and evaluation of Performance parameters like- Bit and Symbol error rates. Spectral bandwidth calculations. Design of various blocks of communication systems such as- Phase-locked Loop, Equalizer and Interleaver.
VLSI DESIGN AND TECHNOLOGY (404182)
Unit 1: Analog CMOS Design
Enhancement MOSFET equivalent circuit, parasitics, as resistor, diode. Active load, current source and push pull inverter amplifiers. Current source and sink. Common source, drain and gate amplifiers. Cascode amplifier. Differential amplifier. CMOS op-amp.
Unit 2: Digital CMOS Design
CMOS Inverter, voltage transfer curve, body effect, hot electron effect, velocity saturation. Static and dynamic dissipations. Power delay product. Noise margin. Combinational logic design, W/L calculations. Transmission gate, design using TGs. λ parameter, layout, Design Rule Check. Technology scaling.
Unit 3: VHDL and Finite State Machines
VHDL design units, modeling styles, synthesizable and non synthesizable test benches, design flow, functions, procedures, attributes, test benches, configurations, packages. Synchronous and asynchronous machines, Finite State Machines (FSM), metastability, state diagrams and VHDL codes for FSMs.
Unit 4: Programmable Logic Devices (PLDs)
Need of PLDs. Comparison with ASIC, general purpose processor, DSP processor, microcontroller, memories etc. Features, specifications, detail architectures, application areas, limitations of Complex Programmable Logic Device (CPLD) and Field Programmable Logic Devices (FPGA).
Unit 5: Fault tolerance and testability
Types of fault, stuck open, short, stuck at 1, 0 faults. Fault coverage. Need of Design for Testability (DFT). Controllability, predictability, testability, Built In Self Test (BIST). Partial and full scan check. Need of boundary scan check, JTAG, Test Access Port (TAP) controller.
COMPUTER NETWORK (404183)
Unit 1: Physical Layer
Data Communications, Networks, Networks models, OSI model, Layers in OSI model, TCP / IP protocol suite, Addressing, Guided and Unguided Transmission media. Switching: Circuit switched networks, Data gram Networks, Virtual circuit networks. Cable networks for Data transmission: Dialup modems, DSL, Cable TV, Cable TV for Data transfer.
Unit 2: Data Link Layer
Data link control: Framing, Flow and error control, Protocols for Noiseless and Noisy Channels, HDLC. Multiple access: Random access, Controlled access. Wired LANS : Ethernet, IEEE standards, standard Ethernet, changes in the standard, Fast Ethernet, Gigabit Ethernet.
Unit 3: Wireless LANS
Wireless LANS : IEEE 802.11–Bluetooth. Connecting LANS: Connecting devices, Backbone networks, Virtual LANS. Virtual circuit networks: Architecture and Layers of Frame Relay and ATM.
Unit 4: Network Layer
Logical addressing: IPv4, IPv6 addresses. Internet Protocol: Internetworking- IPv4, IPv6 - Address mapping- ARP, RARP,BOOTP, DHCP, ICMP, IGMP, Delivery- Forwarding , Routing -Unicast, Multicast routing protocols.
Unit 5: Transport Layer
Process-to-Process delivery, User Datagram Protocol (UDP), Transmission Control, Protocol (TCP), Congestion Control, Quality of services (QoS), Techniques to improve QoS.