29-10-2012, 12:56 PM
Micromechanical System for System-on-Chip Connectivity
[attachment=37271]
ABSTRACT
Micromechanical systems can be combined with microelectronics, photonics or wireless capabilities new generation of Microsystems can be developed which will offer far reaching efficiency regarding space, accuracy, precision and so forth. Micromechanical systems (MEMS) technology can be used fabricate both application specific devices and the associated micro packaging systems that will allow for the integration of devices or circuits, made with non-compatible technologies, with a System-on-Chip environment. The MEMS technology can be used for permanent, semi permanent or temporary interconnection of sub modules in a System-on-Chip implementation. The interconnection of devices using MEMS technology is described with the help of a hearing instrument application and related micropackaging.
INTRODUCTION
MEMS technology has enabled us to realize advanced micro devices by using processes similar to VLSI technology. When MEMS devices are combined with other technologies new generation of innovative technology will b created. This will offer outstanding functionality. Such technologies will have wide scale applications in fields ranging from automotive, aerodynamics, hydrodynamics, bio-medical and so forth. The main challenge is to integrate all these potentially non-compatible technologies into a single working microsystem that will offer outstanding functionality.
The use of MEMS technology for permanent, semi permanent or temporary interconnection of non-compatible technologies like CMOS, BJT, GaAs, SiGe, and so forth into a System-on-Chip environment can be described using an example application. It is a hearing instrument in which an array of acoustical sensors is used to provide dynamic directional sensitivity that can minimize background noise and reverberation thereby increasing speech intelligibility for the user. The micro array can provide dynamically variable directional sensitivity by employing suitable beam forming and tracking algorithms while implanted completely inside the ear canal.
BEAM FORMING USING MICROPHONE ARRAY
The microphone array consists of nine capacitor type microphones arranged in a 3*3 array and utilizes the classical phased array technique for beam forming. In this technique, the relative delay or advance in signal reception is eliminated by applying a delay or advance is that the signal out puts from different microphones can be added to form a beam as shown in figure 1.
MEMS MICROPACKAGING SOLUTION
The MEMS technology can be used to create necessary structures for die level integration of MEMS devices or components and CMOS or non-CMOS, like BJT, GaAs, and Silicon-germanium devices. The basic structure of the proposed mechanism is a socket submodule (figure 4) that holds a die or device. The required no of submodules can be stacked vertically or horizontally to realize a completely system in a micropackage.
DIE TESTING CONFIGURATION
The concept of socket submodules and connectivity can also be used in a die testing platform. The establishment of temporary connectivity for testing a die without exposing the die to otherwise harmful energy sources or contaminations during the test cycles is a major technological challenge. The MEMS submodule can be reconfigured to establish temporary connectivity for die testing with out exposing the die to any contamination while carrying out necessary test procedures. Figure 7 illustrates the die testing configuration using MEMS socket type structures.
CONCLUSION
MEMS technology offers wide range application in fields like biomedical, aerodynamics, thermodynamics and telecommunication and so forth. MEMS technology can be used to fabricate both application specific devices and the associated micropackaging system that will allow for the integration of devices or circuits, made with non compatible technologies, with a SoC environment. The MEMS technology allows permanent, semi permanent and temporary connectivity. The integration of MEMS to present technology will give way to cutting edge technology that will give outstanding functionality and far reaching efficiency regarding space, accuracy precision, cost, and will wide range applications. Describing typical application of MEMS in a hearing instrument application the flexibility and design challenges and various innovative features of MEMS technology is made to understand. In the hearing aid instrument microphone arrays are used to produce directional sensitivity and improve speech intelligibility. The various components and necessary signal conditioning algorithms are implemented in a custom micropackaging that can be implanted inside the ear canal is described.
[attachment=37271]
ABSTRACT
Micromechanical systems can be combined with microelectronics, photonics or wireless capabilities new generation of Microsystems can be developed which will offer far reaching efficiency regarding space, accuracy, precision and so forth. Micromechanical systems (MEMS) technology can be used fabricate both application specific devices and the associated micro packaging systems that will allow for the integration of devices or circuits, made with non-compatible technologies, with a System-on-Chip environment. The MEMS technology can be used for permanent, semi permanent or temporary interconnection of sub modules in a System-on-Chip implementation. The interconnection of devices using MEMS technology is described with the help of a hearing instrument application and related micropackaging.
INTRODUCTION
MEMS technology has enabled us to realize advanced micro devices by using processes similar to VLSI technology. When MEMS devices are combined with other technologies new generation of innovative technology will b created. This will offer outstanding functionality. Such technologies will have wide scale applications in fields ranging from automotive, aerodynamics, hydrodynamics, bio-medical and so forth. The main challenge is to integrate all these potentially non-compatible technologies into a single working microsystem that will offer outstanding functionality.
The use of MEMS technology for permanent, semi permanent or temporary interconnection of non-compatible technologies like CMOS, BJT, GaAs, SiGe, and so forth into a System-on-Chip environment can be described using an example application. It is a hearing instrument in which an array of acoustical sensors is used to provide dynamic directional sensitivity that can minimize background noise and reverberation thereby increasing speech intelligibility for the user. The micro array can provide dynamically variable directional sensitivity by employing suitable beam forming and tracking algorithms while implanted completely inside the ear canal.
BEAM FORMING USING MICROPHONE ARRAY
The microphone array consists of nine capacitor type microphones arranged in a 3*3 array and utilizes the classical phased array technique for beam forming. In this technique, the relative delay or advance in signal reception is eliminated by applying a delay or advance is that the signal out puts from different microphones can be added to form a beam as shown in figure 1.
MEMS MICROPACKAGING SOLUTION
The MEMS technology can be used to create necessary structures for die level integration of MEMS devices or components and CMOS or non-CMOS, like BJT, GaAs, and Silicon-germanium devices. The basic structure of the proposed mechanism is a socket submodule (figure 4) that holds a die or device. The required no of submodules can be stacked vertically or horizontally to realize a completely system in a micropackage.
DIE TESTING CONFIGURATION
The concept of socket submodules and connectivity can also be used in a die testing platform. The establishment of temporary connectivity for testing a die without exposing the die to otherwise harmful energy sources or contaminations during the test cycles is a major technological challenge. The MEMS submodule can be reconfigured to establish temporary connectivity for die testing with out exposing the die to any contamination while carrying out necessary test procedures. Figure 7 illustrates the die testing configuration using MEMS socket type structures.
CONCLUSION
MEMS technology offers wide range application in fields like biomedical, aerodynamics, thermodynamics and telecommunication and so forth. MEMS technology can be used to fabricate both application specific devices and the associated micropackaging system that will allow for the integration of devices or circuits, made with non compatible technologies, with a SoC environment. The MEMS technology allows permanent, semi permanent and temporary connectivity. The integration of MEMS to present technology will give way to cutting edge technology that will give outstanding functionality and far reaching efficiency regarding space, accuracy precision, cost, and will wide range applications. Describing typical application of MEMS in a hearing instrument application the flexibility and design challenges and various innovative features of MEMS technology is made to understand. In the hearing aid instrument microphone arrays are used to produce directional sensitivity and improve speech intelligibility. The various components and necessary signal conditioning algorithms are implemented in a custom micropackaging that can be implanted inside the ear canal is described.