19-11-2012, 04:17 PM
MPC8544E PowerQUICC III Integrated Processor HardwareSpecifications
[attachment=40207]
Key Features
The following list provides an overview of the device feature
set:
• High-performance, 32-bit core enhanced by
resources for embedded cores defined by the Power
ISA, and built on Power Architecture® technology:
— 32-Kbyte L1 instruction cache and 32-Kbyte L1
data cache with parity protection. Caches can be
locked entirely or on a per-line basis, with
separate locking for instructions and data.
— Signal-processing engine (SPE) APU (auxiliary
processing unit). Provides an extensive
instruction set for vector (64-bit) integer and
fractional operations. These instructions use both
the upper and lower words of the 64-bit GPRs as
they are defined by the SPE APU.
Document Number: MPC8544EEC
Rev. 6, 05/2011
MPC8544E PowerQUICC III
Integrated Processor Hardware
Specifications
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6
2 Freescale Semiconductor
MPC8544E Overview
— Double-precision floating-point APU. Provides an instruction set for double-precision (64-bit)
floating-point instructions that use the 64-bit GPRs.
— 36-bit real addressing
— Embedded vector and scalar single-precision floating-point APUs. Provide an instruction set
for single-precision (32-bit) floating-point instructions.
— Memory management unit (MMU). Especially designed for embedded applications. Supports
4-Kbyte–4-Gbyte page sizes.
— Enhanced hardware and software debug support
— Performance monitor facility that is similar to, but separate from, the device performance
monitor
The e500 defines features that are not implemented on this device. It also generally defines some features
that this device implements more specifically. An understanding of these differences can be critical to
ensure proper operations.
• 256-Kbyte L2 cache/SRAM
— Flexible configuration
— Full ECC support on 64-bit boundary in both cache and SRAM modes
— Cache mode supports instruction caching, data caching, or both.
— External masters can force data to be allocated into the cache through programmed memory
ranges or special transaction types (stashing).
– 1, 2, or 4 ways can be configured for stashing only.
— Eight-way set-associative cache organization (32-byte cache lines)
— Supports locking entire cache or selected lines. Individual line locks are set and cleared through
Book E instructions or by externally mastered transactions.
— Global locking and flash clearing done through writes to L2 configuration registers
— Instruction and data locks can be flash cleared separately.
— SRAM features include the following:
– I/O devices access SRAM regions by marking transactions as snoopable (global).
– Regions can reside at any aligned location in the memory map.
– Byte-accessible ECC is protected using read-modify-write transaction accesses for
smaller-than-cache-line accesses.
Electrical Characteristics
This section provides the AC and DC electrical specifications and thermal characteristics for the
MPC8544E. This device is currently targeted to these specifications. Some of these specifications are
independent of the I/O cell, but are included for a more complete reference. These are not purely I/O buffer
design specifications.
SYSCLK and Spread Spectrum Sources
Spread spectrum clock sources are an increasingly popular way to control electromagnetic interference
emissions (EMI) by spreading the emitted noise to a wider spectrum and reducing the peak noise
magnitude in order to meet industry and government requirements. These clock sources intentionally add
long-term jitter in order to diffuse the EMI spectral content. The jitter specification given in Table 5
considers short-term (cycle-to-cycle) jitter only and the clock generator’s cycle-to-cycle output jitter
should meet the MPC8544E input cycle-to-cycle jitter requirement. Frequency modulation and spread are
separate concerns, and the MPC8544E is compatible with spread spectrum sources if the recommendations
listed in Table 6 are observed.
[attachment=40207]
Key Features
The following list provides an overview of the device feature
set:
• High-performance, 32-bit core enhanced by
resources for embedded cores defined by the Power
ISA, and built on Power Architecture® technology:
— 32-Kbyte L1 instruction cache and 32-Kbyte L1
data cache with parity protection. Caches can be
locked entirely or on a per-line basis, with
separate locking for instructions and data.
— Signal-processing engine (SPE) APU (auxiliary
processing unit). Provides an extensive
instruction set for vector (64-bit) integer and
fractional operations. These instructions use both
the upper and lower words of the 64-bit GPRs as
they are defined by the SPE APU.
Document Number: MPC8544EEC
Rev. 6, 05/2011
MPC8544E PowerQUICC III
Integrated Processor Hardware
Specifications
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6
2 Freescale Semiconductor
MPC8544E Overview
— Double-precision floating-point APU. Provides an instruction set for double-precision (64-bit)
floating-point instructions that use the 64-bit GPRs.
— 36-bit real addressing
— Embedded vector and scalar single-precision floating-point APUs. Provide an instruction set
for single-precision (32-bit) floating-point instructions.
— Memory management unit (MMU). Especially designed for embedded applications. Supports
4-Kbyte–4-Gbyte page sizes.
— Enhanced hardware and software debug support
— Performance monitor facility that is similar to, but separate from, the device performance
monitor
The e500 defines features that are not implemented on this device. It also generally defines some features
that this device implements more specifically. An understanding of these differences can be critical to
ensure proper operations.
• 256-Kbyte L2 cache/SRAM
— Flexible configuration
— Full ECC support on 64-bit boundary in both cache and SRAM modes
— Cache mode supports instruction caching, data caching, or both.
— External masters can force data to be allocated into the cache through programmed memory
ranges or special transaction types (stashing).
– 1, 2, or 4 ways can be configured for stashing only.
— Eight-way set-associative cache organization (32-byte cache lines)
— Supports locking entire cache or selected lines. Individual line locks are set and cleared through
Book E instructions or by externally mastered transactions.
— Global locking and flash clearing done through writes to L2 configuration registers
— Instruction and data locks can be flash cleared separately.
— SRAM features include the following:
– I/O devices access SRAM regions by marking transactions as snoopable (global).
– Regions can reside at any aligned location in the memory map.
– Byte-accessible ECC is protected using read-modify-write transaction accesses for
smaller-than-cache-line accesses.
Electrical Characteristics
This section provides the AC and DC electrical specifications and thermal characteristics for the
MPC8544E. This device is currently targeted to these specifications. Some of these specifications are
independent of the I/O cell, but are included for a more complete reference. These are not purely I/O buffer
design specifications.
SYSCLK and Spread Spectrum Sources
Spread spectrum clock sources are an increasingly popular way to control electromagnetic interference
emissions (EMI) by spreading the emitted noise to a wider spectrum and reducing the peak noise
magnitude in order to meet industry and government requirements. These clock sources intentionally add
long-term jitter in order to diffuse the EMI spectral content. The jitter specification given in Table 5
considers short-term (cycle-to-cycle) jitter only and the clock generator’s cycle-to-cycle output jitter
should meet the MPC8544E input cycle-to-cycle jitter requirement. Frequency modulation and spread are
separate concerns, and the MPC8544E is compatible with spread spectrum sources if the recommendations
listed in Table 6 are observed.