30-11-2012, 04:37 PM
ELECTRONIC PACKAGING
[attachment=41937]
Objective:
To provide Packaging Design and mechanical hardware support and service for C-DOT Products.
Role:
To generate Packaging concept for each Product taking into consideration the Aesthetics, thermal and other functional requirements of the Product. To generate fabrication drawings and release them.
Infrastructure:
The Packaging group has eight working level persons. The group has the latest Hardware and Software packages. 3D modelling of the design & analysis are carried out to reduce no. of prototypes.
ELECTRONIC PACKAGING
At sub-rack level, the “jacking-in & out ” of cards with mother board worked-out.This calls for designing proper card ejecting mechanism along with appropriate card and mother board stiffening members. Thermal analysis of each sub-rack helps in identifying temperature patterns existing in the sub-rack.
[attachment=41937]
Objective:
To provide Packaging Design and mechanical hardware support and service for C-DOT Products.
Role:
To generate Packaging concept for each Product taking into consideration the Aesthetics, thermal and other functional requirements of the Product. To generate fabrication drawings and release them.
Infrastructure:
The Packaging group has eight working level persons. The group has the latest Hardware and Software packages. 3D modelling of the design & analysis are carried out to reduce no. of prototypes.
ELECTRONIC PACKAGING
At sub-rack level, the “jacking-in & out ” of cards with mother board worked-out.This calls for designing proper card ejecting mechanism along with appropriate card and mother board stiffening members. Thermal analysis of each sub-rack helps in identifying temperature patterns existing in the sub-rack.