12-12-2012, 06:47 PM
METAL EMBEDDED THIN FILM THERMOMECHANICAL MICROSENSORS
[attachment=43650]
Introduction:
MEMS involving the miniaturized components have great effect in industrial applications.
Effective monitoring and control of hostile manufacturing processes, such as those associated with elevated temperatures, large heat fluxes, and severe strains, are of critical importance.
There have been significant advances in the area of micro-sensor technology in recent years.
Owing to their small sizes, distributed micro-sensors could be incorporated into structures without interfering with normal operation of the work piece.
Thermo mechanical responses can be measured very efficiently by using thin-film sensors.
Which enables significant improvements in real-time monitoring and intelligent control.
Each application of TFTCs and TFSGs requires specific considerations.
Several characterization techniques were employed to investigate thin film material characteristics to ensure the reliability of embedded sensors.
For which A new process for sensor fabrication and embedding was successfully developed
Selection and Optimization of Materials:
Substrate
Dielectric and Sensor Layers
Mask Design
Sensor Fabrication
Sensor Embedding
Characterization
Substrate:
Grinding and polishing were used to bring the surface roughness of substrate down to 100 nm or less.
Multilayer deposition of insulating layer is carried on metal substrate.
Fabrication:
The substrates were thoroughly cleaned in acetone with ultra-sonic agitation followed by isopropanol wash and then rinsed in deionised (DI) water.
Our optimized dielectric multilayer consists of three layers
the exposed metal surface at the edges of the substrate had significant improved adhesion with the final electroplated Ni protective layer.
CONCLUSION:
Thin-film thermo mechanical micro sensors (thermocouples and strain gauges) have been successfully fabricated and embedded into metal structures with micro fabrication and electroplating processes.
Proper insulation is crucial to isolate micro sensors from the metallic substrates.
[attachment=43650]
Introduction:
MEMS involving the miniaturized components have great effect in industrial applications.
Effective monitoring and control of hostile manufacturing processes, such as those associated with elevated temperatures, large heat fluxes, and severe strains, are of critical importance.
There have been significant advances in the area of micro-sensor technology in recent years.
Owing to their small sizes, distributed micro-sensors could be incorporated into structures without interfering with normal operation of the work piece.
Thermo mechanical responses can be measured very efficiently by using thin-film sensors.
Which enables significant improvements in real-time monitoring and intelligent control.
Each application of TFTCs and TFSGs requires specific considerations.
Several characterization techniques were employed to investigate thin film material characteristics to ensure the reliability of embedded sensors.
For which A new process for sensor fabrication and embedding was successfully developed
Selection and Optimization of Materials:
Substrate
Dielectric and Sensor Layers
Mask Design
Sensor Fabrication
Sensor Embedding
Characterization
Substrate:
Grinding and polishing were used to bring the surface roughness of substrate down to 100 nm or less.
Multilayer deposition of insulating layer is carried on metal substrate.
Fabrication:
The substrates were thoroughly cleaned in acetone with ultra-sonic agitation followed by isopropanol wash and then rinsed in deionised (DI) water.
Our optimized dielectric multilayer consists of three layers
the exposed metal surface at the edges of the substrate had significant improved adhesion with the final electroplated Ni protective layer.
CONCLUSION:
Thin-film thermo mechanical micro sensors (thermocouples and strain gauges) have been successfully fabricated and embedded into metal structures with micro fabrication and electroplating processes.
Proper insulation is crucial to isolate micro sensors from the metallic substrates.