09-02-2013, 02:59 PM
European Center for Power Electronics ECPE Demonstrator Programs
[attachment=50375]
Industrial Drives – System Integration
• Extremely compact converter (power density several times higher
compared to commercial converters)
• Development of the key technologies focused on:
– compact design;
– manufacturability;
– cost.
• Proven by demonstrator development (2.2 kW demonstrator).
System Integration Approach
• New system integration concept based on:
Ø Hybrid IPEM integration (Integrated Power Electronic Modules)
Circuit partitioned into three sub-circuits (system components)
• Based on electrical and thermal characteristics of the sub-circuit
• Each sub-circuit manufactured in suitable integration technology
Ø Advanced thermal management concept
• Integrated converter housing (I-Housing);
Ø New integration technologies for passive integration
• Multifunctional components and reduced packaging;
• New electrical and thermal jointing techniques.
Advanced Thermal Management
• Integrated converter housing (I-housing)
Ø Aluminiumcasing containing the three IPEMs;
Ø Heat collector and heat sink for the three IPEMs;
Ø Forced air cooled using a fan.
• Shape and profile designed for optimal heat removal
Ø Several I-housing concepts compared on the basis of heat transfer capability
and manufacturability;
Ø Concept tested experimentally and proven feasible (ΔT< 50 °C, Tamb = 50 °C).
Integration Technologies for Passive Integration in 3D Passive IPEM
• Passive components in state-of-the-art converters
Ø Discrete components assemblies
Ø Bulky, not spatially designed to fit with each other
® Volume occupied by air and packaging parts.
• Higher levels of integration – fewer parts & smaller volume
• Electromagnetic passives integration technology
Ø Planar ceramic integrated passives (CPES)
- energy density not high enough for this application.
Ø Electrolytic capacitor technology?
[attachment=50375]
Industrial Drives – System Integration
• Extremely compact converter (power density several times higher
compared to commercial converters)
• Development of the key technologies focused on:
– compact design;
– manufacturability;
– cost.
• Proven by demonstrator development (2.2 kW demonstrator).
System Integration Approach
• New system integration concept based on:
Ø Hybrid IPEM integration (Integrated Power Electronic Modules)
Circuit partitioned into three sub-circuits (system components)
• Based on electrical and thermal characteristics of the sub-circuit
• Each sub-circuit manufactured in suitable integration technology
Ø Advanced thermal management concept
• Integrated converter housing (I-Housing);
Ø New integration technologies for passive integration
• Multifunctional components and reduced packaging;
• New electrical and thermal jointing techniques.
Advanced Thermal Management
• Integrated converter housing (I-housing)
Ø Aluminiumcasing containing the three IPEMs;
Ø Heat collector and heat sink for the three IPEMs;
Ø Forced air cooled using a fan.
• Shape and profile designed for optimal heat removal
Ø Several I-housing concepts compared on the basis of heat transfer capability
and manufacturability;
Ø Concept tested experimentally and proven feasible (ΔT< 50 °C, Tamb = 50 °C).
Integration Technologies for Passive Integration in 3D Passive IPEM
• Passive components in state-of-the-art converters
Ø Discrete components assemblies
Ø Bulky, not spatially designed to fit with each other
® Volume occupied by air and packaging parts.
• Higher levels of integration – fewer parts & smaller volume
• Electromagnetic passives integration technology
Ø Planar ceramic integrated passives (CPES)
- energy density not high enough for this application.
Ø Electrolytic capacitor technology?