30-05-2013, 12:12 PM
INTEL CENTRINO MOBILE TECHNOLOGY
[attachment=54485]
Intel Centrino mobile technology connect without wires.
This is Intel's first integrated computing technology designed from the ground up for wireless notebook PCs.
With Intel Centrino mobile technology, three components work together to enable outstanding mobile performance, extended battery life and integrated wireless LAN capability in thinner and lighter notebooks. These components include :
Intel Pentium-M Processor
Intel 855 Chipset family
Intel PRO/Wireless 2100 network connection
PENTIUM – M PROCESSOR
codename : BANIAS
Intel’s first processor designed specifically for mobile PCs
high performance, low power mobile processor with several micro-architectural enhancements over existing Intel mobile processors
Fully compatible with existing Intel architecture-based software
manufactured on Intel’s advanced 0.13 micron process technology
Pipeline between the P-III’s 10-stage and P 4’s 20-stage
Speed : 900 MHz to 1.7 GHz
Features of Pentium-M
Micro-Ops Fusion
uses fewer CPU resources
merges CPU operations prior to execution
delivers efficiency in performance & power mgmt
Advanced Instruction Prediction
• processor studies past behavior of pgms and intelligently anticipate what instructions will be needed next
• includes a loop detector and an indirect branch target buffer
Power-Optimized 400MHz Processor System Bus
• bus remains powered down until it senses incoming data form the chipset
• portions of the bus are turned on only when they are needed
Intelligent Power Distribution
• finer granularity hardware gating mechanisms
turns on hardware units partially based on program demand
1MB power managed L2 tranfer cache
• significant reduction in memory data latency providing a big performance improvement
• instruction & data Caches are 32KB in size on L1 Cache
• cache runs slightly slower to save energy enabling longer battery life
Streaming SIMD Extensions 2 (SSE2)
• new extensions to SIMD capabilities that MMX technology and SSE technology delivered by adding 144 new instructions
• include 128-bit SIMD integer arithmetic and 128-bit SIMD double-precision floating-point operations.
• reduces the overall number of instructions required to execute a particular program task = increased performance
• accelerate a broad range of applications, including video, speech, image, photo processing, encryption and other scientific applications
Intel 855GM Chipset GMCH
The Intel 855GM GMCH component provides the processor interface, DDR SDRAM interface, display interface, and Hub interface in an Intel 855GM chipset based system.
• was designed in tandem with Intel Pentium-M processor
• 400MHz system bus delivers a high bandwidth connection betweenthe Intel Pentium-M processor and platform
• Support for up to 2GB of DDR 266/200 MHz PC1600/PC1200 memory technology
• Integrated Intel Extreme Graphics-2 technology - including 3D rendering acceleration and 2D hardware acceleration
• Support for Hi-Speed Universal Serial Bus(USB 2.0) with backward compatibility with USB 1.1
• The latest AC97 audio delivers six channels of audio for enhanced sound quality with full surround digital sound
• Dual ATA-100 controllers support the fastest IDE interface for transfers to storage devices
[attachment=54485]
Intel Centrino mobile technology connect without wires.
This is Intel's first integrated computing technology designed from the ground up for wireless notebook PCs.
With Intel Centrino mobile technology, three components work together to enable outstanding mobile performance, extended battery life and integrated wireless LAN capability in thinner and lighter notebooks. These components include :
Intel Pentium-M Processor
Intel 855 Chipset family
Intel PRO/Wireless 2100 network connection
PENTIUM – M PROCESSOR
codename : BANIAS
Intel’s first processor designed specifically for mobile PCs
high performance, low power mobile processor with several micro-architectural enhancements over existing Intel mobile processors
Fully compatible with existing Intel architecture-based software
manufactured on Intel’s advanced 0.13 micron process technology
Pipeline between the P-III’s 10-stage and P 4’s 20-stage
Speed : 900 MHz to 1.7 GHz
Features of Pentium-M
Micro-Ops Fusion
uses fewer CPU resources
merges CPU operations prior to execution
delivers efficiency in performance & power mgmt
Advanced Instruction Prediction
• processor studies past behavior of pgms and intelligently anticipate what instructions will be needed next
• includes a loop detector and an indirect branch target buffer
Power-Optimized 400MHz Processor System Bus
• bus remains powered down until it senses incoming data form the chipset
• portions of the bus are turned on only when they are needed
Intelligent Power Distribution
• finer granularity hardware gating mechanisms
turns on hardware units partially based on program demand
1MB power managed L2 tranfer cache
• significant reduction in memory data latency providing a big performance improvement
• instruction & data Caches are 32KB in size on L1 Cache
• cache runs slightly slower to save energy enabling longer battery life
Streaming SIMD Extensions 2 (SSE2)
• new extensions to SIMD capabilities that MMX technology and SSE technology delivered by adding 144 new instructions
• include 128-bit SIMD integer arithmetic and 128-bit SIMD double-precision floating-point operations.
• reduces the overall number of instructions required to execute a particular program task = increased performance
• accelerate a broad range of applications, including video, speech, image, photo processing, encryption and other scientific applications
Intel 855GM Chipset GMCH
The Intel 855GM GMCH component provides the processor interface, DDR SDRAM interface, display interface, and Hub interface in an Intel 855GM chipset based system.
• was designed in tandem with Intel Pentium-M processor
• 400MHz system bus delivers a high bandwidth connection betweenthe Intel Pentium-M processor and platform
• Support for up to 2GB of DDR 266/200 MHz PC1600/PC1200 memory technology
• Integrated Intel Extreme Graphics-2 technology - including 3D rendering acceleration and 2D hardware acceleration
• Support for Hi-Speed Universal Serial Bus(USB 2.0) with backward compatibility with USB 1.1
• The latest AC97 audio delivers six channels of audio for enhanced sound quality with full surround digital sound
• Dual ATA-100 controllers support the fastest IDE interface for transfers to storage devices