30-07-2013, 05:10 PM
The optical input, optical output, and pixel circuitry are in a single location, thereby minimizing the electrical connections between the three. Future smart pixel array development should consider one other aspect of integration, that of integrating the lenslet arrays, either with the glass substrate (original scheme) or with the GaAs substrate (future scheme). At present, commercial lenslet arrays are used which are poorly matched to the VCSEL beam profiles and which are difficult to align. Smaller alignment errors will allow smaller photodetectors, resulting in faster systems.
Scaling VCSEL/Si smart pixel arrays
Understanding the manufacturing cost minimization issues involved in scaling to larger array sizes is important in meeting market place demands for SPAs. Since smaller VCSEL arrays are more reliable and less expensive, it may be more cost effective to partition large dimensional SPAs into smaller units. A scaling model needs to be realized in order to characterize packaging effects on the assembly yield. This model should provide quantitative guidelines to transfer one system design to another. This can then provide the system designer the option of building N x N arrays from 4 N/2 x N/2 arrays, 16 N/4 x N/4 arrays, etc. It is critical to guide the designs of these novel SPA-based systems so as to enhance reliability and reduce manufacturing cost. The scaling model should predict assembly yields for different options.
Reference: https://seminarproject.net/Thread-smart-...z2aWnO6xGo
Scaling VCSEL/Si smart pixel arrays
Understanding the manufacturing cost minimization issues involved in scaling to larger array sizes is important in meeting market place demands for SPAs. Since smaller VCSEL arrays are more reliable and less expensive, it may be more cost effective to partition large dimensional SPAs into smaller units. A scaling model needs to be realized in order to characterize packaging effects on the assembly yield. This model should provide quantitative guidelines to transfer one system design to another. This can then provide the system designer the option of building N x N arrays from 4 N/2 x N/2 arrays, 16 N/4 x N/4 arrays, etc. It is critical to guide the designs of these novel SPA-based systems so as to enhance reliability and reduce manufacturing cost. The scaling model should predict assembly yields for different options.
Reference: https://seminarproject.net/Thread-smart-...z2aWnO6xGo