12-10-2017, 02:27 PM
A photonic integrated circuit (PIC) or integrated optical circuit is a device that integrates multiple (at least two) photonic functions and, as such, is similar to an electronic integrated circuit. The main difference between the two is that a photonic integrated circuit provides functions for the information signals imposed on optical wavelengths typically in the visible or near infrared spectrum from 850 nm to 1650 nm.
The most commonly used material platform for photonic integrated circuits is indium phosphide (InP), which allows the integration of several optically active and passive functions on the same chip. The initial examples of photonic integrated circuits were simple 2 sectioned Bragg (DBR) reflector lasers, consisting of two independently controlled device sections: a gain section and a DBR mirror section. Accordingly, all modern tunable monolithic lasers, widely tunable lasers, externally modulated lasers and transmitters, integrated receivers, etc., are examples of photonic integrated circuits. Current state-of-the-art devices integrate hundreds of functions into a single chip. Pioneering work in this field was done at Bell Laboratories. The most notable academic centers of excellence in photonics are the University of California at Santa Barbara, USA. UU. And the Eindhoven University of Technology in the Netherlands.
A 2005 development showed that silicon can, even if it is an indirect forbidden band material, continue to be used to generate laser light through Raman nonlinearity. Such lasers are not electrically driven but optically driven and therefore still need an additional optical pump laser source.
Unlike electronic integration where silicon is the dominant material, the system's photonic integrated circuits have been fabricated from a variety of material systems, including electro-optical crystals such as lithium niobate, silicon on silicon, silicon on insulation , various polymers and semiconductor materials used to manufacture semiconductor lasers such as GaAs and InP. Different materials systems are used because each provides different advantages and limitations depending on the function to be integrated. For example, silica (silicon dioxide) PICs have very desirable properties for passive photonic circuits such as AWGs (see below) because of their comparatively low losses and low thermal sensitivity, GaAs or InP based PICs allow the direct integration of light and silicon sources PICs allow the cointegration of photonics with transistor-based electronics.
Manufacturing techniques are similar to those used in electronic integrated circuits where photo-lithography is used for pattern wafers for etching and deposition of material. Unlike electronics in which the main device is the transistor, there is no single dominant device. The range of devices required on a chip includes low loss interconnect waveguides, power dividers, optical amplifiers, optical modulators, filters, lasers and detectors. These devices require a variety of different materials and manufacturing techniques, making it difficult to perform all of them on a single chip.
More recent techniques using photonic resonance interferometry are causing UV LEDs to be used for optical computing requirements with much cheaper costs that lead to consumer electronics pezherz PHz.
The most commonly used material platform for photonic integrated circuits is indium phosphide (InP), which allows the integration of several optically active and passive functions on the same chip. The initial examples of photonic integrated circuits were simple 2 sectioned Bragg (DBR) reflector lasers, consisting of two independently controlled device sections: a gain section and a DBR mirror section. Accordingly, all modern tunable monolithic lasers, widely tunable lasers, externally modulated lasers and transmitters, integrated receivers, etc., are examples of photonic integrated circuits. Current state-of-the-art devices integrate hundreds of functions into a single chip. Pioneering work in this field was done at Bell Laboratories. The most notable academic centers of excellence in photonics are the University of California at Santa Barbara, USA. UU. And the Eindhoven University of Technology in the Netherlands.
A 2005 development showed that silicon can, even if it is an indirect forbidden band material, continue to be used to generate laser light through Raman nonlinearity. Such lasers are not electrically driven but optically driven and therefore still need an additional optical pump laser source.
Unlike electronic integration where silicon is the dominant material, the system's photonic integrated circuits have been fabricated from a variety of material systems, including electro-optical crystals such as lithium niobate, silicon on silicon, silicon on insulation , various polymers and semiconductor materials used to manufacture semiconductor lasers such as GaAs and InP. Different materials systems are used because each provides different advantages and limitations depending on the function to be integrated. For example, silica (silicon dioxide) PICs have very desirable properties for passive photonic circuits such as AWGs (see below) because of their comparatively low losses and low thermal sensitivity, GaAs or InP based PICs allow the direct integration of light and silicon sources PICs allow the cointegration of photonics with transistor-based electronics.
Manufacturing techniques are similar to those used in electronic integrated circuits where photo-lithography is used for pattern wafers for etching and deposition of material. Unlike electronics in which the main device is the transistor, there is no single dominant device. The range of devices required on a chip includes low loss interconnect waveguides, power dividers, optical amplifiers, optical modulators, filters, lasers and detectors. These devices require a variety of different materials and manufacturing techniques, making it difficult to perform all of them on a single chip.
More recent techniques using photonic resonance interferometry are causing UV LEDs to be used for optical computing requirements with much cheaper costs that lead to consumer electronics pezherz PHz.