17-12-2012, 11:48 AM
3D IC technology
13D IC technology.pptx (Size: 560.49 KB / Downloads: 109)
What is 3D IC ?
In electronics, a three-dimensional integrated circuit (3D IC) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit.
The semiconductor industry is pursuing this promising technology in many different forms, but it is not yet widely used; consequently, the definition is still somewhat fluid.
Manufacturing technologies :
As of 2008 there are four ways to build a 3D IC:
Die-on-Wafer – Electronic components are built on two semiconductor wafers. One wafer is diced; the singulated dice are aligned and bonded onto die sites of the second wafer. As in the wafer-on-wafer method, thinning and TSV creation are performed either before or after bonding. Additional dice may be added to the stacks before dicing.
Benefits
Footprint – More functionality fits into a small space. This extends Moore’s Law and enables a new generation of tiny but powerful devices.
Cost – Partitioning a large chip into multiple smaller dies with 3D stacking can improve the yield and reduce the fabrication cost if individual dies are tested separately.
Heterogeneous integration – Circuit layers can be built with different processes, or even on different types of wafers. This means that components can be optimized to a much greater degree than if they were built
Energy performance
Wire length reduction has an impact on the cycle time and the energy dissipation
Energy dissipation decreases with the number of layers used in the design
Following graphs are based on the 3D tool described later in the presentation
Conclusion
3D IC design is a relief to interconnect driven IC design.
Still many manufacturing and technological difficulties
Needs strong EDA applications for automated design