Seminar Topics & Project Ideas On Computer Science Electronics Electrical Mechanical Engineering Civil MBA Medicine Nursing Science Physics Mathematics Chemistry ppt pdf doc presentation downloads and Abstract

15. Money Pad, The Future Wallet

you can refer these pages to get the details on MONEY PAD THE FUTURE WALLET
https://seminarproject.net/Thread-mo...ure-wallet

https://seminarproject.net/Thread-mo...let?page=4

https://seminarproject.net/Thread-mo...3#pid23793
https://seminarproject.net/Thread-mo...?pid=20918
https://seminarproject.net/Thread-mo...llet--5974
https://seminarproject.net/Thread-mo...llet--6940
https://seminarproject.net/Thread-mo...let--12744

artificial immune system

ECE-11













A
Technical
Paper presentation
On









[EC 04]
BY

D.Sairam(05631A0433)

D.Satishvarma(05631A0437)

ISTE Membership numbers: 1782 &1786





















Accredited by NBA







ECE-11







1



ECE-11


ABSTRACT







































































ECE-11







































































2



ECE-11


VLSI
Very Large Scale Integrated Circuit




Why Design Integrated Circuits?

Integrated Circuit (IC) technology is the enabling technology for a
whole host of innovative devices and systems that have changed the way we live.
Integrated circuits are much smaller and consume less power than the discrete
components used to build electronic systems before the 1960s. Integration allows
us to build systems with many more transistors, allowing much more computing
power to be applied to solving a problem. Integrated circuits are also much easier
to design and manufacture and are more reliable than discrete systems; that
makes it possible to develop special-purpose systems that are more efficient than
general – purpose computers for the task at hand.



























Components of Chip:-

An Integrated Circuit (IC) is a combination of interconnected
circuit elements inseparably associated on or within a continuous substrate.

The substrate
is the supporting material upon or within which an IC is
fabricated or to which an IC is attached.








ECE-11








3



ECE-11


A monolithic IC is an IC whose elements are formed in place upon
or within a semiconductor substrate with at lease one of the elements formed
within the substrate.

A hybrid IC consists of a combination of two or more IC
types or an IC with some discrete elements.

A wafer (or slice)
is the basic physical unit used in processing. It
generally contains a large number of identical ICs, Typically,
the wafer is circular; production wafers have a diameter of
4,5 or 6 in. The chip is one of the repeated ICs on a wafer. A
typical production wafer may contain as few as 20 or 30 ICs
or as many as several hundred or even several thousand,
depending upon the complexity and size of the circuit being
fabricated. The terms die and bar are used interchangeably
for chip in some companies.

A test plug, or process control bar (PCB),
or process control monitor (PCM), is a special chip
that is repeated only a few times on each wafer. It is used to
monitor the process parameters of the technology. After
processing, the validity of the process is verified by
measuring, at the wafer probe level, the characteristics of

devices and / or circuits on the test plug.

If the

measurements of key parameters at the test plug level are not
acceptable, the wafer is discarded. Front end construction of
components

A test cell, or test lead,
is a special chip repeated only a few times on each
wafer. It differs from the test plug in that the circuit
designer includes this cell specifically to monitor the
performance of elementary sub circuits or subcomponents

please send the information

---

Moletronics- an invisible technology

please send the information soon

hiii..i need the full details for the topics :

Investigation of the types of handovers in wireless communication system,
indoor Positioning,Fuel Cell Vehicle,NIGHT VISION TECHNOLOGY,Wafer Bumping ,Smart Home Technologies,. Radar Tracking System : Concept and Application, Electronic Cooling Systems ,Electronic Paper Display ,
Blue laser,SMATV system,Electronic Nose

to get information about the topic"wireless communication system," refer the link bellow

https://seminarproject.net/Thread-wirele...ull-report

Fpga offloads dsp?s.

---

Fpga offloads dsp?s.

Fpga offloads dsp?s.

can i get a brief seminar on any of the related topics..pls

Light emitting polymers,nokia-morph-technology,Money Pad, The Future Wallet

to get information about the topic"Light emitting polymers" refer the link bellow

https://seminarproject.net/Thread-light-...-lep--4225

https://seminarproject.net/Thread-light-...225?page=2

https://seminarproject.net/Thread-light-...lymers-lep
to get information about the topic"nokia-morph-technology" refer the link bellow
https://seminarproject.net/Thread-nokia-...technology

hi
you can refer these pages to get the details on MONEY PAD THE FUTURE WALLET
https://seminarproject.net/Thread-mo...ure-wallet

https://seminarproject.net/Thread-mo...let?page=4

https://seminarproject.net/Thread-mo...3#pid23793
https://seminarproject.net/Thread-mo...?pid=20918
https://seminarproject.net/Thread-mo...llet--5974
https://seminarproject.net/Thread-mo...llet--6940
https://seminarproject.net/Thread-mo...let--12744

send me full seminar report on RFID Radio Frequency Identification

What is Cryptography

hi bro,
pls mail me detailed reports on
>DNA based computers
>Digital scent technology

are these topics based on ieee reports

seminor presentation on Heloi display

---

hai,
pls send seminor presentation on finger print control system in offices