13-05-2011, 02:47 PM
Microwave.ppt (Size: 718.5 KB / Downloads: 123)
Flip Chip Technology
Introduction
Advancements in the packaging of semiconductor devices traditionally use wire bonds to provide the interconnect from device to substrate or to other devices
Along with the rapid advances in microwave and millimeter wave subsystem development
a growing interest concerning chip interconnection techniques has developed.
The importance of quality of these interconnects
a large impact on the performance of the entire subsystem, especially at high frequencies.
Flip chip offers advantages over traditional interconnect schemes.
A smaller overall footprints, better thermal heat transfer
Wire Bonding
Flip Chip Interconnection
Flip Chip Interconnection
Flip Chip Interconnection
Proximity Effect in Flip-Chip Structure
Why Flip Chip Technology?
Comparison
Stud Bump Bonding Technology
Micro Bump Bonding Technology
Conclusion
The need for smaller packaging
Flip chip interconnect process → more compact fashion
Improved electrical performance
Reduced interconnect length → lower inductance and reduced signal loss → lower power requirements
The demands of high frequency applications
Limitation of the wire interconnect → flip-chip bump connection