19-04-2012, 01:27 PM
3D IC TECHNOLOGY
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INTRODUCTION
3D IC technology assures higher levels of miniaturization and integration.
It focuses on portraying advances in interconnect
technologies and reduction of interconnect delays.
It is a single circuit built by stacking and integrating.
Separately-built layers
Energy performance:
Energy dissipation decreases with increase in the number of layers used in the design.
ADVANTAGES :
3D ICs offer many significant benefits, including:
SPEED
DESIGN
HETEREOGENEOUS INTEGRATION
BANDWIDTH
applications:
Three Dimensional Read-Only Memory ( 3D - ROM).
3D -ROM is a new non-volatile semiconductor
memory with lower cost , higher capacity(>4x) and
comparable bandwidth.
It is compatible with standard CMOS process.
More importantly, 3D-ROM can be readily
integrated with RAM/flash ROM.